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Chemtools 10Cc Lead Free Solder Paste

Chemtools 10Cc Lead Free Solder Paste

Tube / Syringe (Sn100Cpt)

Low stock

$44

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Overview

30G LEAD FREE SOLDER PASTE TUBE / SYRINGECHEMTOOLS

SN100C / NC257-2 has been developed to offer extremelybroad process windows for printing, wetting and pin-probe testing.

The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed even at the elevated temperatures required for today’s lead-free alloys.

This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.

Features:

  • Composition of Tin and Copper means that there is no lead component and also leads to extemely bright and shiny solder joinits.
  • Broad Printing Process Window
  • Low-Tombstoning
  • Excellent Wetting
  • Clear Pin-Probe Testable Residue
  • 24 Hour Stencil Life
  • No Head-in-Pillow
  • Reduces Voiding Under Micro-BGAs
  • 12-14 Hour Tack Time
  • Low Solder Beading

Handling and Storage:

  • NC257-2 has a refrigerated shelf life of 6 months at 4°C (40°F).
  • Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
  • Mix the product lightly and thoroughly (1-2 mins. max) to ensure even distribution of any separated material.
  • Do not store new and used paste in the same container, and reseal any opened containers while not in use.
  • Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.

Paste Application:

  • The general metal load for this product is 88.5%. If issues regarding solder beading and slump are present, a metal load of 89% is recommended. The 89% metal load is also recommended for customers using a Rheo pump.
  • Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of½ to 5/8 inch is normally sufficient to begin).
  • Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
  • NC257-2 provides the necessary tack time and force for today’s high speed placement equipment, which willenhance product performance and reliability.
  • Cleaning of your stencil will vary by application; however, it can be accomplished using AIM 200AX-10 stencil cleaner.

Cleaning:

  • NC257-2 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.
  • Please refer to the AIM cleaner matrix for a list of compatible cleaning materials.

Specifications:

  • Appearance: Gray, Smooth, Creamy
  • Alloy: SN100C®
  • Melting Point: 227°C
  • Particle Size: T3, T4, T5
  • Powder Shape: Spherical
  • Viscosity: Print/Dispense

This Product is offered and supplied by Dick Smith pursuant to the Terms and Conditions.

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